Job Description

Position Overview:

We are seeking a skilled and proactive professional to oversee and optimize our Surface Mount Technology (SMT) operations. This role involves managing SMT production lines, ensuring quality standards, and driving continuous improvement initiatives in a dynamic electronics manufacturing environment.

Key Responsibilities:

• Oversee and facilitate training for machine operators to ensure consistent performance.
• Operate and program SMT machinery, including screen printers and pick-and-place systems, ensuring compliance with IPC-A-610 standards.
• Utilize inspection tools such as SPI, AOI, and x-ray systems to verify assembly quality.
• Conduct thorough root cause investigations for major defects and implement effective corrective and preventive measures.
• Create and maintain thermal profiles for reflow ovens to support both new product introductions and existing assemblies.
• Lead initiatives to enhance manufacturability using Six Sigma or similar methodologies.
• Collaborate with engineering teams to review product designs for manufacturability and assembly efficiency.
• Supervise assembly line activities, including product builds, functional testing, and final inspections.
• Establish and monitor process parameters for solder paste application, component placement, reflow, and inspection.
• Track and analyze process yields to ensure optimal throughput and capability.
• Investigate SMT-related defects and recommend actionable solutions.
• Oversee PCB inspection and functional testing processes.
• Develop and refine procedures for assembly and rework to support continuous improvement.

Qualifications:

• Bachelor’s degree in Engineering required; Master’s degree preferred.
• At least 3 years of hands-on experience with SMT processes and equipment.
• Minimum of 5 years in electronics manufacturing.
• Proven experience conducting DFM reviews and resolving technical challenges.
• Strong understanding of SMT components, PCB assembly, and related equipment.
• Proficiency with AOI, ICT, FCT, and various soldering techniques (e.g., wave, reflow).
• Experience with MPM printers and Air Vac rework systems.
• Familiarity with IPC/J-STD-001 Class III standards.
• Demonstrated ability to debug and optimize manufacturing lines.
• Experience launching at least one full-scale electronics production line.

Physical & Travel Requirements:

• Must be able to lift up to 35 lbs and perform tasks that involve standing, sitting, bending, and reaching.
• Regular use of hands and frequent communication is required.
• Occasional travel, including overnight stays, may be necessary.
• Must be able to drive to client locations safely.

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